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Fabrication and characterization of IC compatible through-wafer polysilicon interconnects

Referentgranskad
Luusua, Ismo; Henttinen, Kimmo; Pekko, Panu; Vehmas, Tapani
ECS Transactions2007Publicationer information ikon

Fully tileable photodiode matrix for medical imaging by using through-wafer interconnects

Referentgranskad
DOI
10.1016/j.nima.2007.06.055
Juntunen, Mikko; Ji, Fan; Henttinen, Kimmo; Luusua, Ismo; Hietanen, Iiro; Eränen, Simo
Nuclear Instruments and Methods in Physics Research. Section A: Accelerators, Spectrometers, Detecto...2007Publicationer information ikon

Through-wafer polysilicon interconnect fabrication with in-situ boron doping

Referentgranskad
DOI
10.1557/PROC-872-J5.5
Luusua, Ismo; Henttinen, Kimmo; Pekko, Panu; Vehmas, Tapani; Luoto, Hannu
MRS Online Proceedings2005Publicationer information ikon

Upside down T-shape through-wafer interconnects for fully tileable photodiode matrix for medical CT imaging

Referentgranskad
DOI
10.1016/j.sna.2012.06.025
Juntunen, Mikko; Ji, Fan; Hietanen, Iiro; Eränen, Simo
Sensors and Actuators A: Physical2012Publicationer information ikon

Fabrication of silicon based through-wafer interconnects for advanced chip scale packaging

Referentgranskad
DOI
10.1016/j.sna.2007.02.030
Ji, Fan; Leppävuori, Seppo; Luusua, Ismo; Henttinen, Kimmo; Eränen, Simo; Hietanen, Iiro; Juntunen, ...
Sensors and Actuators A: Physical2008Publicationer information ikon

Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies

Referentgranskad
DOI
10.1109/ECTC.2013.6575770
Zoschke, K.; Manier, C.-A.; Wilke, M.; Jürgensen, N.; Oppermann, H.; Ruffieux, D.; Dekker, James; He...
Electronic Components and Technology Conference (ECTC)2013Publicationer information ikon

Wafer scale packaging of MEMS by using plasma activated wafer bonding

Referentgranskad
Suni, Tommi; Henttinen, Kimmo; Lipsanen, Antti; Dekker, James; Luoto, Hannu; Kulawski, Martin
ECS Proceedings Volumes2005Publicationer information ikon

Conformance testing framework for service oriented interconnection technologies

Referentgranskad
Öppen tillgång
Keränen, Janne S.; Räty, Tomi; Jurmu, Petri; Mäki, Matti; Puolitaival, Olli-Pekka
International Journal of E-Business Development2013Publicationer information ikon

Tolerance management in wafer scale glass optics

Referentgranskad
Mäyrä, Aki; Mäkinen, Jukka-Tapani; Kondratyev, Vasily; Aikio, Janne
IMAPS Nordic Annual Conference 20142014Publicationer information ikon

Solderless Interconnection and Packaging Technique for Embedded Active Components

Referentgranskad
Kujala, A.; Tuominen, R.; Kivilahti, J.
-1999

Fabrication and characterization of IC compatible through-wafer polysilicon interconnects

Referentgranskad
2007

Fully tileable photodiode matrix for medical imaging by using through-wafer interconnects

Referentgranskad
DOI
10.1016/j.nima.2007.06.055
2007

Through-wafer polysilicon interconnect fabrication with in-situ boron doping

Referentgranskad
DOI
10.1557/PROC-872-J5.5
2005

Upside down T-shape through-wafer interconnects for fully tileable photodiode matrix for medical CT imaging

Referentgranskad
DOI
10.1016/j.sna.2012.06.025
2012

Fabrication of silicon based through-wafer interconnects for advanced chip scale packaging

Referentgranskad
DOI
10.1016/j.sna.2007.02.030
2008

Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies

Referentgranskad
DOI
10.1109/ECTC.2013.6575770
2013

Wafer scale packaging of MEMS by using plasma activated wafer bonding

Referentgranskad
2005

Conformance testing framework for service oriented interconnection technologies

Referentgranskad
Öppen tillgång
2013

Tolerance management in wafer scale glass optics

Referentgranskad
2014

Solderless Interconnection and Packaging Technique for Embedded Active Components

Referentgranskad
1999